FLIP CHIP TECHNOLOGY + FLIP CHIP ASSEMBLY (MICROELECTRONICS)
  • BT
    SURFACE MOUNT TECHNOLOGY, SMT (MICROELECTRONICS)
  • UDC
    621.3.049.7,17*3
  • Descriptor GER
    FLIP-CHIP-TECHNIK + FLIP-CHIP-MONTAGE (MIKROELEKTRONIK)
  • Descriptor ENG
    FLIP CHIP TECHNOLOGY + FLIP CHIP ASSEMBLY (MICROELECTRONICS)
  • Descriptor FRE
    TECHNIQUE FLIP-CHIP + MONTAGE FLIP-CHIP (MICROÉLECTRONIQUE)
  • Variant GER
    FLIP-CHIP-MONTAGE (MIKROELEKTRONIK)
  • Variant GER
    TECHNIK/FLIP-CHIP-TECHNIK (MIKROELEKTRONIK)
  • Variant GER
    MONTAGE/FLIP-CHIP-MONTAGE (MIKROELEKTRONIK)
  • Variant ENG
    TECHNOLOGY/FLIP-CHIP-TECHNOLOGY (MICROELECTRONICS)
  • Variant ENG
    ASSEMBLY/FLIP-CHIP-ASSEMBLY (MICROELECTRONICS)
  • Variant ENG
    FLIP CHIP ASSEMBLY (MICROELECTRONICS)
  • Variant FRE
    MONTAGE FLIP-CHIP (MICROÉLECTRONIQUE)
  • Variant FRE
    FLIP-CHIP/TECHNIQUE (MICROÉLECTRONIQUE)
  • Variant FRE
    FLIP-CHIP/MONTAGE (MICROÉLECTRONIQUE)
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Last data import from Alma: 1 January 2025